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Proceedings Papers

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022
Paper No: IPACK2022-97175
https://doi.org/10.1115/IPACK2022-97175
View Paper titled, RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study
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Topics: Hazardous substances, Manufacturing, Phthalate plasticizers, Electronic equipment, Plasticizers, Risk, Semiconductor industry, Temperature, Weight (Mass)
Proceedings Papers

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Ming-Han Zhuang, Teny Shih, David Lai, Yu-Po Wang
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Paper No: IPACK2021-66660
https://doi.org/10.1115/IPACK2021-66660
View Paper titled, Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
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Topics: Ball-Grid-Array packaging, Cloud computing, Internet, Signals
Proceedings Papers

Material Impact With Package Solution for 5G RF Application

Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 27–29, 2020
Paper No: IPACK2020-2507
https://doi.org/10.1115/IPACK2020-2507
View Paper titled, Material Impact With Package Solution for 5G RF Application
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Topics: Design, Millimeter waves, Signals, System architecture
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Packaging Challenges of Thin High Bandwidth POP

Fletcher (Cheng-Piao) Tung, Jensen (Ying-Chou) Tsai, Yu-Po Wang, Joe (Chih-Nan) Lin, Gary (Yue-Long) Fan
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A014, November 11–14, 2019
Paper No: IMECE2019-11181
https://doi.org/10.1115/IMECE2019-11181
View Paper titled, Packaging Challenges of Thin High Bandwidth POP
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Topics: Manufacturing, Package on package, Packaging, Reliability, Warping
Proceedings Papers

Advanced Packaging Solution for High Density FCCSP Molding Warpage

Shuai-Lin Liu, Ward Ye, Yu-Po Wang, Long-Yuan Wang, Fred Lin
Proc. ASME. IMECE2019, Volume 2B: Advanced Manufacturing, V02BT02A032, November 11–14, 2019
Paper No: IMECE2019-10563
https://doi.org/10.1115/IMECE2019-10563
View Paper titled, Advanced Packaging Solution for High Density FCCSP Molding Warpage
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Topics: Density, Lasers, Molding, Packaging, Warping
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Paper No: IPACK2019-6354
https://doi.org/10.1115/IPACK2019-6354
View Paper titled, Double Side System in Package Development Challenge for Heterogeneous Integration
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Cu Pillar Bump FCBGA Package Design and Reliability Assessments

Nicholas Kao, Yen-Chang Hu, Yuan-Lin Tseng, Eason Chen, Jeng-Yuan Lai, Yu-Po Wang
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 177-182, October 31–November 6, 2008
Paper No: IMECE2008-69019
https://doi.org/10.1115/IMECE2008-69019
View Paper titled, Cu Pillar Bump FCBGA Package Design and Reliability Assessments
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Topics: Columns (Structural), Design, Reliability, Stress, Solders, Flip-chip, Flip-chip devices, Geometry, Shapes, Stress concentration
Proceedings Papers

Thermal Performance Improvement of Through Silicon Via (TSV) Technology on 3-D Stack Packages

Wei-Shen Kuo, Mingzong Wang, Eason Chen, Jeng-Yuan Lai, Yu-Po Wang
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1523-1526, October 31–November 6, 2008
Paper No: IMECE2008-67240
https://doi.org/10.1115/IMECE2008-67240
View Paper titled, Thermal Performance Improvement of Through Silicon Via (TSV) Technology on 3-D Stack Packages
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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Silicon, Thermal conductivity, Design, Diluents, Electronic packages, Energy consumption, Energy dissipation, Flip-chip
Proceedings Papers

Experimental Study of Solder Joint Reliability for External Heat Sink Installation on FCBGA

Nicholas Kao, Jeng Yuan Lai, Yu Po Wang, C. S. Hsiao
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 269-274, November 11–15, 2007
Paper No: IMECE2007-42743
https://doi.org/10.1115/IMECE2007-42743
View Paper titled, Experimental Study of Solder Joint Reliability for External Heat Sink Installation on FCBGA
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Topics: Heat sinks, Reliability, Solder joints, Solders, Creep, Energy consumption, Environmental health and safety, Risk, Temperature, Ball-Grid-Array packaging
Proceedings Papers

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

Don-Son Jiang, Joe Hung, Yu-Po Wang, C. S. Hsiao
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1109-1113, July 17–22, 2005
Paper No: IPACK2005-73063
https://doi.org/10.1115/IPACK2005-73063
View Paper titled, Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability
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Topics: Finishes, Lead-free solders, Reliability, Solders
Proceedings Papers

Optimized Thermal Design for USB-WLAN Module

Eason Chen, Jeng Yuan Lai, Ming Zong Wang, Yu-Po Wang, C. S. Hsiao
Proc. ASME. IMECE2005, Heat Transfer, Part A, 775-779, November 5–11, 2005
Paper No: IMECE2005-82247
https://doi.org/10.1115/IMECE2005-82247
View Paper titled, Optimized Thermal Design for USB-WLAN Module
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Topics: Computational fluid dynamics, Design, Simulation, Wireless LAN
Proceedings Papers

Underfill Assessments and Validations for Low-k FCBGA

Nicholas Kao, Jeng Yuan Lai, Jase Jiang, Yu Po Wang, C. S. Hsiao
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 345-350, November 5–10, 2006
Paper No: IMECE2006-15432
https://doi.org/10.1115/IMECE2006-15432
View Paper titled, Underfill Assessments and Validations for Low-k FCBGA
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Delamination, Delays, Failure, Failure mechanisms, Finite element analysis, Finite element model, Flat heat pipes, Flip-chip
Proceedings Papers

Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem

Eason Chen, Jeng Yuan Lai, Yu-Po Wang, C. S. Hsiao
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 303-308, November 5–10, 2006
Paper No: IMECE2006-15421
https://doi.org/10.1115/IMECE2006-15421
View Paper titled, Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem
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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Design