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Yu Po Wang
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021
Paper No: IPACK2021-66660
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 27–29, 2020
Paper No: IPACK2020-2507
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Paper No: IPACK2020-2528
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
Proceedings Papers

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A014, November 11–14, 2019
Paper No: IMECE2019-11181
Proceedings Papers

Proc. ASME. IMECE2019, Volume 2B: Advanced Manufacturing, V02BT02A032, November 11–14, 2019
Paper No: IMECE2019-10563
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Paper No: IPACK2019-6354
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1109-1113, July 17–22, 2005
Paper No: IPACK2005-73063
Proceedings Papers

Proc. ASME. IMECE2005, Heat Transfer, Part A, 775-779, November 5–11, 2005
Paper No: IMECE2005-82247