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Yunda Wang
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Paper No: IPACK2013-73290
Proceedings Papers

Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 501-506, July 8–12, 2012
Paper No: ICNMM2012-73110
Journal Articles
Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 51-54, June 3–5, 2008
Paper No: MicroNano2008-70116